SOLDER PILLARS FOR EMBEDDING SEMICONDUCTOR DIE
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United States of America Patent
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Issued Date -
Jul 2, 2015
app pub date -
Dec 5, 2014
filing date -
Dec 31, 2013
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Abstract
A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. Pillars, for example of solder, may also formed on the substrate, around the semiconductor die. The pillars are formed to a height above the substrate that is greater than the height of the substrate-mounted semiconductor die, including any wire bonds, above the substrate. A second group of one or more semiconductor die, such as flash memory die, may be affixed to the substrate, on top of the solder pillars without contacting the substrate-mounted semiconductor die.
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