SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
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United States of America Patent
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app pub date -
Feb 26, 2014
filing date -
Dec 27, 2013
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Abandoned
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Abstract
A substrate processing apparatus includes a common pipe connected to a process container wherethrough a first and second process gases flow; a buffer unit connected to an upstream side of the common pipe and having a width greater than a diameter of the common pipe; a first supply pipe wherethrough the first process gas flows, connected to a first surface of the buffer unit where the common pipe is connected or a second surface of the buffer unit opposite to the first surface; and a second supply pipe wherethrough the second process gas flows, connected to the first or second surface. Each of the first and second supply pipes is installed outer than the common pipe, and a distance between the first and second surfaces is shorter than a distance between a center axis of the common pipe and that of the first or second supply pipe.
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