Electroconductive Polyamide/Polyphenylene Ether Resin Composition, Method for Preparing the Same and Molded Product for Vehicle Using the Same
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United States of America Patent
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Issued Date -
Jul 2, 2015
app pub date -
Dec 30, 2014
filing date -
Dec 30, 2013
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Abstract
Provided herein is an electroconductive polyamide/polyphenylene ether resin composition, a method for preparing the same, and a molded product for vehicle manufactured using the same. The composition includes a base resin (a) including polyphenylene ether (a-1) and polyamide (a-2); an impact modifier (b); a compatibilizer (c); and an electroconductive filler (d), wherein a pH of the electroconductive filler (d) is about 4 to about 8.
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