HEAT DISSIPATION STRUCTURE OF MOBILE DEVICE
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United States of America Patent
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Issued Date -
Jul 2, 2015
app pub date -
Dec 31, 2013
filing date -
Dec 31, 2013
priority date (Note) -
Abandoned
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Abstract
A heat dissipation structure of mobile device includes a case and a heat generation component. The case defines a receiving space. The heat generation component is disposed in the receiving space. One face of the heat generation component is attached to one face of a cooling chip. The other face of the cooling chip is attached to the case. The cooling chip serves to absorb the heat generated by the heat generation component and conduct the heat to the case to dissipate the heat, whereby the heat dissipation problem of the mobile device is solved and an energy-saving effect is achieved.
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