MANUFACTURING METHOD OF PROBING DEVICE

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United States of America Patent

SERIAL NO

14656730

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Abstract

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A manufacturing method of a probing device is provided. The manufacturing method includes following steps. First, a plurality of space transformers is disposed on a reinforcing plate and the space transformer includes a plurality of first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings are formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer.

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Patent Owner(s)

Patent OwnerAddress
MPI CORPORATIONNO 155 ZHONGHE ST ZHUBEI CITY HSINCHU COUNTY 30267

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Ming-Chi Hsinchu Hsiang, TW 33 220
Li, Chung-Che Hsinchu Hsiang, TW 5 45
Wu, Chien-Chou Hshinchu Hsiang, TW 14 79

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