TIN-PLATED COPPER-ALLOY TERMINAL MATERIAL

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United States of America Patent

APP PUB NO 20150184302A1
SERIAL NO

14560467

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Abstract

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By forming a nickel-based coating layer or a cobalt-based coating layer having a coating thickness of 0.005 μm or larger and 0.05 μm or smaller on an outermost surface of a tin-based surface layer of a terminal material of low-insertion force in which an asperity shape of an interface between a copper-tin alloy layer and a tin-based surface layer is controlled, it is possible to reduce insertion force of fitting even though all-purpose tin-plated terminal material is used by combination.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI MATERIALS CORPORATIONTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inoue, Yuki Naka-shi, JP 103 646
Kato, Naoki Tokyo, JP 180 2009
Nakaya, Kiyotaka Naka-shi, JP 36 39

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