METHOD OF COATING BY PULSED BIPOLAR SPUTTERING
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United States of America Patent
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Issued Date -
Jul 2, 2015
app pub date -
Jun 28, 2013
filing date -
Jun 29, 2012
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Abandoned
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Abstract
A method of pulsed bipolar sputtering including applying a sputtering pulse (−) during a first period of time (T−) and applying a revers voltage pulse during a subsequent second period of time (T+). The step of applying the revers voltage pulse comprises controlling, in particular adjusting, the timing of the revers voltage pulse (T+). This way high quality sputtering is achieved, in particular for sputtering temperature sensitive materials.
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