Semiconductor wafer conveying tool
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United States of America Patent
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Jul 17, 2018
Grant Date -
Jun 25, 2015
app pub date -
Jul 25, 2013
filing date -
Jul 26, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
The semiconductor wafer conveying tool which can realize the uniform heating to a surface of a semiconductor wafer when heating the semiconductor wafer is a semiconductor wafer conveying tool which holds the semiconductor wafer having a predetermined diameter to convey it wherein the tool is provided with a main body having an opening with a diameter which is larger than a diameter of the semiconductor wafer, and at least three supporting members each having a predetermined length, containing plural pins which are arranged corresponding to the diameter of the semiconductor wafer and being configured to be a holding mechanism for holding the semiconductor wafer concentrically at a projection position from an inner periphery portion of the main body around the opening, as shown in FIG. 1.
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