PACKAGED IC DEVICES AND ASSOCIATED IC DEVICE PACKAGING METHODS
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United States of America Patent
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Issued Date -
Jun 25, 2015
app pub date -
Dec 23, 2013
filing date -
Dec 23, 2013
priority date (Note) -
Abandoned
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Abstract
A method of making packaged integrated circuit (IC) devices includes mixing a waste thermoset polymer material with a thermosetting polymer to form a mixed thermosetting polymer and packaging IC devices in a molding operation using the mixed thermosetting polymer to thereby recycle the waste thermoset polymer material. A packaged IC device includes an IC device and an encapsulating material surrounding the IC device. The encapsulating material includes a thermoset polymer matrix and thermoset polymer particles dispersed in thermoset polymer matrix.
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