ADHESIVE FILM FOR ADHERING TO SUBSTRATE
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United States of America Patent
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app pub date -
Jun 9, 2014
filing date -
Dec 25, 2013
priority date (Note) -
Abandoned
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Abstract
An adhesive piece for adhering to a substrate is disclosed, wherein the adhesive piece has a film, an opening and a separating structure. The opening is formed on the film and configured to enable the substrate to be connected to a flexible printed circuit. The separating structure is formed on the film and has a plurality of perforated cuts, wherein the plurality of perforated cuts form the perforated line which is configured to be extended from an edge of the opening to an edge of the film.
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