BONDED STRAINED SEMICONDUCTOR WITH A DESIRED SURFACE ORIENTATION AND CONDUCTANCE DIRECTION
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United States of America Patent
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app pub date -
Feb 23, 2015
filing date -
Aug 3, 2006
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Abstract
According to various method embodiments, a semiconductor layer is oriented to a substrate. The semiconductor layer has a surface orientation and is oriented to the substrate to provide a desired direction of conductance for the surface orientation. The oriented semiconductor layer is bonded to the substrate to strain the semiconductor layer. Various embodiments provide a tensile strain, and various embodiments provide a compressive strain. Other aspects and embodiments are provided herein.
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