REDISTRIBUTION LAYER ALLOY STRUCTURE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Dec 13, 2013
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Dec 13, 2013
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Abstract
A semiconductor structure includes a device, a conductive pad over the device and a Ag1-xYx alloy pillar disposed on the conductive pad, wherein the Y of the Ag1-xYx alloy comprises metals forming complete solid solution with Ag at arbitrary weight percentage, and wherein the X of the Ag1-xYx alloy is in a range of from about 0.005 to about 0.25.
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