HEAT DISSIPATING FIN AND HEAT DISSIPATING DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20150168082A1
SERIAL NO

14575708

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A heat dissipating fin including a main body and a through hole is provided. The through hole is formed at the main body. The through hole includes at least two collar portions, and the collar portions are formed on an edge of the through hole. Each of the collar portions includes a first extending portion and a first bridging portion. A first angle is formed between the first extending portion and the first bridging portion. The heat dissipating fin and the heat dissipating device can form a uniform holding force between the heat dissipating fin and the pipe, reduce the damage of the pipe in the assembly, and improve the heat dissipation efficiency.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
ASUSTEK COMPUTER INCNO 15 LITE RD PEITOU DIST TAIPEI CITY 11259

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HUANG, Yung-Ching Taipei, TW 24 226

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