METHOD AND SYSTEM FOR A THERMAL CUT-OFF USING LOW-TEMPERATURE SOLDER FOR A SOLID STATE LIGHTING DEVICE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 18, 2015
app pub date -
Dec 17, 2013
filing date -
Dec 17, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
In some embodiments, a method and system including a component of a lighting device; a first electrical conductor coupled to the component of the lighting device; a tensioned electrical conductor; and an electrically conductive connection structure coupling the first electrical conductor to the tensioned electrical conductor, the connection structure reflowing to decouple the first electrical conductor from the tensioned electrical conductor in response to the connection structure being subjected to a thermal load exceeding a predetermined threshold melting point.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully