Metal Nanoparticle Synthesis and Conductive Ink Formulation
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United States of America Patent
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Issued Date -
Jun 18, 2015
app pub date -
Oct 16, 2014
filing date -
Dec 16, 2013
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Abstract
A conductive ink formuation comprising metal nanoparticles and the preparation of the metal nanoparticles therein are disclosed. The ink formulation comprises at least one type of metal nanoparticles and solvent, which is to adjust the viscosity and surface tension of the ink formulation as well as the aggregation of the metal nanoparticles. The ink formulation is stable and demonstrates optimal performance, such as, improved jetting performance and good wetting property. The ink formulatin can be printed on a substrate and be further processed by sintering. The resultant film is of high conductivity. Since the annealing temperature in the present invention is relatively low, the fabrication process is compatible with plastic substrate used for flexible electronics.
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