Ultrasonic joining method and ultrasonic joining device

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United States of America Patent

PATENT NO 9399332
APP PUB NO 20150165719A1
SERIAL NO

14561411

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Abstract

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An ultrasonic joining method for bonding paper material (5), in particular paper, paperboard or cardboard, comprising the following steps: introducing the paper material (5) into a gap (4) between an ultrasonic horn (2) and an anvil (3), applying a joining force in a joining force direction (6) to the paper material (5) in the gap (4), and setting the ultrasonic horn (2) into an ultrasonic vibration in order to join the paper material (5), characterized in that an ultrasonic frictional welding operation is carried out, in which the joining force direction (6) is not parallel to the direction of vibration (7) of the ultrasonic vibration.

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Patent Owner(s)

Patent OwnerAddress
SYNTEGON TECHNOLOGY GMBHSTUTTGARTER STRASSE 130 WAIBLINGEN 71332

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wieduwilt, Ulrich Schwaebisch Gmuend, DE 29 107

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