CHEMICAL MECHANICAL POLISHING CONDITIONER WITH HIGH QUALITY ABRASIVE PARTICLES
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United States of America Patent
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Issued Date -
Jun 18, 2015
app pub date -
Nov 7, 2014
filing date -
Dec 16, 2013
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Abandoned
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Abstract
The present invention relates to a chemical mechanical polishing conditioner with high quality abrasive particles, comprising a substrate; a binding layer disposed on the substrate; and a plurality of abrasive particles placed on the binding layer, and the abrasive particles are placed on the substrate by the binding layer; wherein the chemical mechanical polishing conditioner with high quality abrasive particles is moved to pass through a water jet and a high pressure fluid by a conveying device, and the high pressure fluid is applied on the abrasive particles through the water jet to remove one or more than one risk diamond included in the abrasive particles. Therefore, the present invention can improve a problem of conventional risk diamond residue on the conditioner, thereby enhancing the polishing performance and service time of the conditioner.
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