LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACURING THE SAME
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United States of America Patent
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Issued Date -
Jun 11, 2015
app pub date -
Oct 27, 2014
filing date -
Dec 10, 2013
priority date (Note) -
Abandoned
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Abstract
A light emitting diode package (LED) includes two electrodes spaced from each other, an insulating layer sandwiched between the two electrodes, an LED die arranged on the two electrodes and electrically connecting therewith, and an encapsulation layer covering the LED die and the coating layer. Each electrode includes a conductive sheet and a plurality of connecting pins connecting to the conductive sheet. A thickness of each of the connecting pins is smaller than that of the conductive sheet. A top surface of each of the connecting pins is lower than that of the conductive sheet. The LED package further includes a coating layer coating the connecting pin, part of the coating pin is sandwiched between the top surface of the connecting pin and the encapsulation layer.
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