TWO PART DUAL-CURE ADHESIVE FOR USE IN ELECTRONICS
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United States of America Patent
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Issued Date -
Jun 11, 2015
app pub date -
Jul 19, 2012
filing date -
Jul 22, 2011
priority date (Note) -
Abandoned
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Abstract
The disclosure relates to a two-part dual-cure adhesive composition comprising a first Part (A) comprising a radiation polymerizable polyisocyanate prepolymer and a second Part (B) comprising a polyol. The disclosed adhesive can be used on substrates with electronic components to make electronic assemblies.
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