METHOD FOR MANUFACTURING AN ELECTRIC DEVICE BY CONNECTING A WIRING BOARD TO AN OBJECT AND ELECTRIC DEVICE INCLUDING A BOARD
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United States of America Patent
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Issued Date -
Jun 4, 2015
app pub date -
Nov 26, 2014
filing date -
Nov 29, 2013
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Abstract
A method for manufacturing an electric device by connecting a wiring board to an object is disclosed. This method for manufacturing an electric device comprises: applying a wiring board having a first via hole on a mounting face of an object to fix the wiring board; placing a heater having a recess to the wiring board, the heater being adjusted so that the recess overlaps a boundary between the first via hole and a surface of the wiring board; and melting a soldering metal so that the soldering metal enters into the recess and the first via hole.
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