Aluminum coated copper bond wire and method of making the same
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United States of America Patent
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May 8, 2018
Issued Date -
N/A
app pub date -
May 7, 2013
filing date -
May 7, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A wire, preferably a bonding wire for bonding in microelectronics, contains a copper core with a surface and coating layer containing aluminum superimposed over the surface of the copper core. The ratio of the thickness of the coating layer to the diameter of the copper core is from 0.05 to 0.2 μm. The wire has a diameter in the range of from 100 μm to 600 μm and specified standard deviations of the diameter of the copper core and of the thickness of the coating layer. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing at least two elements and the wire, to a propelled device containing the electric device, and to a process of connecting two elements through the wire by wedge bonding.
First Claim
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
- H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
- B21F:WORKING OR PROCESSING OF WIRE
- C22F:CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS MET....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- C22C:ALLOYS
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