BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIE
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United States of America Patent
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app pub date -
Nov 18, 2014
filing date -
Dec 3, 2013
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Abandoned
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Abstract
A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. A bridge structure is also mounted to the substrate, with the semiconductor die fitting within a trench formed in a bottom surface of the bridge structure. The bridge structure may be formed from a semiconductor wafer into either a dummy bridge structure functioning as a mechanical spacer layer, or an IC bridge structure functioning as both a mechanical spacer layer and an integrated circuit semiconductor die. Memory die may also be mounted atop the bridge structure.
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