ELECTRONIC PAPER MODULE, ELECTRONIC PAPER DISPLAY DEVICE AND MANUFACTURING METHOD OF ELECTRONIC PAPER

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United States of America Patent

APP PUB NO 20150153626A1
SERIAL NO

14347104

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Abstract

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An electronic paper module, an electronic paper display device and a manufacturing method of an electronic paper module are disclosed, and the electronic paper module including an array substrate and an electronic ink containing layer, a transparent sealant, a transparent conductive film layer and a protective layer disposed in order on the array substrate, the electronic ink containing layer is provided with electronic ink containing holes therein, the electronic ink containing holes are provided with electronic ink therein. The transparent sealant is used to encapsulate the electronic ink containing layer, and the transparent conductive film layer is disposed over the transparent sealant. Because no microcapsule structure is required in the electronic paper module, a process flow is simplified, and production costs are effectively reduced.

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Patent Owner(s)

Patent OwnerAddress
BOE TECHNOLOGY GROUP CO LTDNO 10 JIUXIANQIAO RD CHAOYANG DISTRICT BEIJING 100015
BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO LTDNO 8 XIHUANZHONGLU BDA BEIJING 100176

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cai, Peizhi Beijing, CN 86 211

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