Real-time individual electronic enclosure cooling system
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United States of America Patent
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Oct 25, 2016
Grant Date -
Jun 4, 2015
app pub date -
Oct 13, 2014
filing date -
Sep 23, 2011
priority date (Note) -
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Abstract
This discloses apparatuses for cooling individual server racks or electrical enclosures. These devices maintain target enclosure temperatures within plus or minus 1 or 2 degrees F. The devices employ industrial cooling using staged cooling towers to evaporatively reach temperatures below the wet bulb temperature of the ambient air. Methods for using such apparatuses are disclosed as well.
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