METHODS AND COMPOSITIONS FOR INCREASING INK CLAY LOADING IN HEATSET INK FORMULATIONS WHILE MAINTAINING INK GLOSS, AND INK FORMULATIONS PRODUCED THEREFROM
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May 21, 2013
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May 30, 2012
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Abstract
A surface-modified hydrophobic clay composition for an ink formulation comprises up to 99 wt % clay particles with a particle-size distribution characterized in that at least 10% are smaller than 0.2 microns, at least 25% are smaller than 0.5 microns, and at least 95% are less than 5 microns; and from about 1 wt % to about 10 wt % of one or more organic compounds selected from quaternary ammonium compounds, organic acids, fatty acids, organic silanes, or organic polysilanes. The surface-modified hydro-phobic day composition may be produced by various methods, including a slurry method or a dry-mixing method. Ink clay loadings in heatset ink formulations may be increased to 10-15% without losing ink gloss. Inks may be produced with lower solvent, resin, and/or pigment concentrations, thereby reducing cost.
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