DIELECTRIC MATERIALS
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United States of America Patent
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Issued Date -
May 28, 2015
app pub date -
Nov 25, 2014
filing date -
Nov 25, 2013
priority date (Note) -
Abandoned
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Abstract
Certain polyphenylene oligomers having good solvent strip resistance, low coefficient of thermal expansion and good adhesion to a variety of surfaces are useful as thin-film dielectric materials in electronics applications.
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