USE OF A CONFORMAL COATING ELASTIC CUSHION TO REDUCE THROUGH SILICON VIAS (TSV) STRESS IN 3-DIMENSIONAL INTEGRATION
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 28, 2015
app pub date -
Jun 6, 2013
filing date -
Jun 7, 2012
priority date (Note) -
Published
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Abstract
Integrated circuit assemblies, as well as methods for creating the same, are provided. The integrated circuit assembly includes a first chip and a second chip, including respective face surfaces, wherein the first chip and the second chip are bonded in a face-against-face contact configuration. The integrated circuit assembly includes a via disposed to pass through the first chip and the second chip. The via is surrounded by at least one material of the respective first chip and the second chip. A cushion layer encapsulating at least a portion of the via is formed between the via and the at least one material surrounding the via.
First Claim
all claims..Other Claims data not available
Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
---|---|---|---|---|---|
EP | A1 | EP2859585 | Jun 06, 2013 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
APPLICATION PUBLISHED WITH SEARCH REPORT | USE OF CONFORMAL COATING ELASTIC CUSHION TO REDUCE THROUGH SILICON VIAS (TSV) STRESS IN 3-DIMENSIONAL INTEGRATION | Apr 15, 2015 | |||
WO | A1 | WO2013184880 | Jun 06, 2013 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
INTERNATIONAL APPLICATION PUBLISHED WITH INTERNATIONAL SEARCH REPORT | USE OF CONFORMAL COATING ELASTIC CUSHION TO REDUCE THROUGH SILICON VIAS (TSV) STRESS IN 3-DIMENSIONAL INTEGRATION | Dec 12, 2013 | |||
TW | A | TW201405738 | Jun 06, 2013 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
LAID OPEN APPLICATION FOR PATENT OR PATENT OF ADDITION | Integrated circuit assembly having a cushion layer within a via, and a method of integrating such a circuit assembly | Feb 01, 2014 | |||
JP | A | JP2015524172 | Jun 06, 2013 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
Published unexamined patent application | 三次元集積におけるシリコン貫通電極(TSV)応力を低減するためのコンフォーマルコーティング弾性クッションの使用 | Aug 20, 2015 | |||
CN | A | CN104396009 | Jun 06, 2013 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
UNEXAMINED APPLICATION FOR A PATENT FOR INV. | Use of conformal coating elastic cushion to reduce through silicon vias (TSV) stress in 3-dimensional integration | Mar 04, 2015 | |||
KR | A | KR20150022987 | Jun 06, 2013 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
UNEXAMINED PATENT APPLICATION | USE OF CONFORMAL COATING ELASTIC CUSHION TO REDUCE THROUGH SILICON VIAS (TSV) STRESS IN 3-DIMENSIONAL INTEGRATION | Mar 04, 2015 |
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
RENSSELAER POLYTECHNIC INSTITUTE | 110 8TH STREET TROY NY 12180-3590 |
International Classification(s)

- 2013 Application Filing Year
- H01L Class
- 22267 Applications Filed
- 20713 Patents Issued To-Date
- 93.03 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
McDonald, John F | Clifton Park, US | 16 | 262 |
# of filed Patents : 16 Total Citations : 262 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 14 Citation Count
- H01L Class
- 71.29 % this patent is cited more than
- 10 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Nov 28, 2026 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
- No Legal Status data available.

Matter Detail

Renewals Detail
