VERTICALLY CONNECTED INTEGRATED CIRCUITS
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United States of America Patent
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Issued Date -
May 28, 2015
app pub date -
Nov 27, 2013
filing date -
Nov 27, 2013
priority date (Note) -
Abandoned
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Abstract
In some examples, an integrated circuit (IC) includes a semiconductor substrate defining a perimeter of the integrated circuit and a castellation formed at the perimeter. The IC also may include a layer including an electrically conductive material formed on a surface of the castellation. In some examples, the layer including the electrically conductive material is not substantially parallel to adjacent portions of the perimeter of the IC. The integrated circuit may be used in a system, in which the metallized castellation may be used to electrically connect the IC to an external structure, such as another IC or a printed board.
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