ELECTRONIC DEVICE MANUFACTURE USING LOW-k DIELECTRIC MATERIALS
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United States of America Patent
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May 28, 2015
app pub date -
Dec 16, 2014
filing date -
Jan 25, 2011
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Abstract
Materials and methods for manufacturing electronic devices and semiconductor components using low dielectric materials comprising polyimide based aerogels are described. Additional methods for manipulating the properties of the dielectric materials and affecting the overall dielectric property of the system are also provided.
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