METHOD OF FORMING A TOUCH PANEL

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United States of America Patent

APP PUB NO 20150144255A1
SERIAL NO

14099946

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Abstract

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A method of forming a touch panel includes bonding a transparent conductive transfer film (TCTF) with a cover layer, followed by patterning the TCTF into a first electrode layer. A second electrode layer is formed on a top surface of a transparent substrate, followed by forming an adhesive layer above the second electrode layer. Finally, a bottom surface of the first electrode layer is bonded with a top surface of the adhesive layer, thereby resulting in the touch panel.

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Patent Owner(s)

Patent OwnerAddress
HENGHAO TECHNOLOGY CO LTDNO 2-1 WENHUA RD HSINCHU INDUSTRIAL PARK HUKOU TOWNSHIP HSINCHU COUNTY 30352

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
PENG, YEN-CHUN Taoyuan County, TW 6 29

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