APPARATUSES FACILITATING FLUID FLOW INTO VIA HOLES, VENTS, AND OTHER OPENINGS COMMUNICATING WITH SURFACES OF SUBSTRATES OF SEMICONDUCTOR DEVICE COMPONENTS
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United States of America Patent
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app pub date -
Jan 28, 2015
filing date -
Feb 10, 2006
priority date (Note) -
Abandoned
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Abstract
A method for removing material from surfaces of at least a portion of at least one recess or at least one aperture extending into a surface of a substrate includes pressurizing fluid so as to cause the fluid to flow into the at least one recess or the at least one aperture. The fluid may be pressurized by generating a pressure differential across the substrate, which causes the fluid to flow into or through the at least one aperture or recess. Apparatus for pressurizing fluid so as to cause it to flow into or through recesses or apertures in a substrate are also disclosed.
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