METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE
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United States of America Patent
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Issued Date -
May 21, 2015
app pub date -
Nov 17, 2014
filing date -
Nov 20, 2013
priority date (Note) -
Abandoned
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Abstract
A method for manufacturing an LED (light emitting diodes) package includes providing a substrate having electrodes; providing an LED chip, the LED chip arranged on the substrate and electrically contacting the electrodes; providing an UV-curing adhesive layer, the UV-curing adhesive layer arranged on the substrate and entirely packaging the LED chip and the electrodes therein, and then the UV-curing adhesive layer being solidified.
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