NON-CYANIDE ELECTROLYTIC GOLD PLATING SOLUTION
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United States of America Patent
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Issued Date -
May 21, 2015
app pub date -
Sep 19, 2013
filing date -
Oct 4, 2012
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Abstract
The present invention provides a non-cyanogen type electrolytic gold plating solution, which can form a plating film capable of maintaining a high hardness even when the plating film is subjected to a heat treatment. A non-cyanogen type electrolytic gold plating solution of the present invention includes: a gold source including an alkaline salt of gold sulfite or ammonium of gold sulfite; and a conductive salt including sulfite and sulfate. The non-cyanogen type electrolytic gold plating solution includes a salt of at least one of iridium, ruthenium, and rhodium in a metal concentration of 1 to 3000 mg/L. Further, the non-cyanogen type electrolytic gold plating solution preferably includes a crystal adjuster. The crystal adjuster is particularly preferably thallium.
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