Coil Arrangement with Metal Filling

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20150137313A1
SERIAL NO

14534311

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Devices, methods and production devices that relate to the forming of a coil on a semiconductor substrate are provided. Arranged within the coil is a metal filling, for example with a density of less than 20%.

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Patent Owner(s)

Patent OwnerAddress
MAXLINEAR INC5966 LA PLACE COURT SUITE 100 CARLSBAD CA 92008

International Classification(s)

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  • 2014 Application Filing Year
  • C23C Class
  • 2649 Applications Filed
  • 2034 Patents Issued To-Date
  • 76.79 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2014201520162017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Marak, Arnold Villach, AT 2 0
Tschuden, Bernhard Villach, AT 1 0

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  • C23C Class
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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges196909157554014613421801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0501001502002503003504004505005506006507007508008509009501000

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