MULTILAYERED WIRING SUBSTRATE
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United States of America Patent
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Issued Date -
May 21, 2015
app pub date -
Nov 11, 2014
filing date -
Nov 13, 2013
priority date (Note) -
Abandoned
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Abstract
[Objective] To provide a multilayer wiring substrate in which, even when a core substrate is thinned, the core substrate can reliably accommodate a capacitor.
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