FAST CURE EPOXY RESINS AND PREPREGS OBTAINED THEREFROM
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United States of America Patent
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Issued Date -
May 14, 2015
app pub date -
May 15, 2013
filing date -
May 18, 2012
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Abstract
Fast cure resin system comprise semisolid epoxy resins and finely divided curatives of particle size less than 25 microns. The resins are dry to the touch, can be readily combined with fibrous reinforcement to provide prepregs which can be rapidly cured in a short moulding cycle.
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