THREE-DIMENSIONAL MODULES FOR ELECTRONIC INTEGRATION
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United States of America Patent
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Issued Date -
May 14, 2015
app pub date -
May 9, 2013
filing date -
May 17, 2012
priority date (Note) -
Abandoned
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Abstract
An electronic module (20, 39, 60, 80, 132, 140, 144) includes a substrate (21), which includes a dielectric material having a cavity (40, 42, 134, 142) formed therein. First conductive contacts (44) within the cavity are configured for contact with at least one first electronic component (32) that is mounted in the cavity. Second conductive contacts (44) on a surface of the substrate that surrounds the cavity are configured for contact with at least a second electronic component (28, 30) that is mounted over the cavity. Conductive traces (36, 48) within the substrate are in electrical communication with the first and second conductive contacts.
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