PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
May 14, 2015
app pub date -
Apr 7, 2014
filing date -
Nov 13, 2013
priority date (Note) -
Abandoned
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Abstract
A fan-out package structure including a heat radiating side edge that includes a semiconductor substrate; a bond pad located on the semiconductor substrate; and a redistribution layer connected with the bond pad and located on the semiconductor substrate, wherein an end of the redistribution layer extends to a sidewall of the semiconductor substrate, and the end is coplanar with the sidewall.
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