SEMICONDUCTOR MODULE WITH RADIATION FINS
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United States of America Patent
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Issued Date -
May 14, 2015
app pub date -
Mar 15, 2013
filing date -
Mar 22, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor module with radiation fins includes a semiconductor module including a metal base. The metal base has an outer circumferential portion surrounding the same and a top panel portion surrounded by the outer circumferential portion. One side of the top panel portion is disposed with a plurality of semiconductor chips through a plurality of corresponding insulating substrates and the other side of the top panel portion is disposed with radiation fins. The plurality of semiconductor chips is connected to electric wiring to electrically connect to the outside of the semiconductor module. A thickness of the top panel portion is less than a thickness of the outer circumferential portion. The top panel portion between the insulating substrates includes a groove having an opening narrower than a bottom portion. The plurality of semiconductor chips is sealed together with the groove by resin.
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