MODULE IC PACKAGE STRUCTURE WITH ELECTRICAL SHIELDING FUNCTION AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
May 14, 2015
app pub date -
Nov 10, 2013
filing date -
Nov 10, 2013
priority date (Note) -
Abandoned
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Abstract
A module IC package structure includes a substrate unit, an electronic unit, a package unit and a shielding unit. The substrate unit including a circuit substrate, a grounding layer disposed inside the circuit substrate, and an outer conductive structure disposed on the outer surrounding peripheral surface of the circuit substrate. The outer conductive structure includes a plurality of outer conductive layers. The grounding layer is exposed from the circuit substrate for directly contacting the outer conductive layers. The electronic unit includes a plurality of electronic components disposed on the circuit substrate. The package unit includes a package gel body disposed on the circuit substrate to enclose the electronic components. The shielding unit includes a metal shielding layer enclosing the package gel body and directly contacting the outer conductive structure. Whereby, the grounding layer is electrically connected to the metal shielding layer through the outer conductive structure directly.
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