LIGHT-EMITTING DIODE PROVIDED WITH SUBSTRATE HAVING PATTERN ON REAR SIDE THEREOF, AND METHOD FOR MANUFACTURING SAME
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United States of America Patent
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Issued Date -
May 14, 2015
app pub date -
Apr 15, 2013
filing date -
Apr 18, 2012
priority date (Note) -
Abandoned
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Abstract
A method for manufacturing a light-emitting diode is provided. First, a substrate having a front or top surface and a rear or bottom surface is provided. An uneven pattern is formed on the rear or bottom surface. A light-emitting semiconductor layer is formed by stacking a first semiconductor layer, an active layer, and a second semiconductor layer on the front or top surface of the substrate having the uneven pattern. The light-emitting semiconductor layer and the substrate are separated into a plurality of light-emitting cells.
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