Method For Minimizing Voids When Soldering Printed Circuit Boards And Soldering Device For Carrying Out Said Method
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United States of America Patent
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Issued Date -
May 14, 2015
app pub date -
Nov 3, 2014
filing date -
Nov 11, 2013
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Abstract
A method for minimizing voids when soldering a printed circuit board being equipped with components, in particular with electrical and/or electronic components, includes oscillation of the printed circuit board while the solder situated between the components and the printed circuit board is being melted or after it has been melted. In this respect, the frequency of the oscillation changes between a starting frequency and a final frequency. Preferably, the oscillation is introduced in a direction of the printed circuit board plane by directly or indirectly coupling at least one actuator to at least one lateral edge of the printed circuit board, wherein the lateral edge of the printed circuit board, the edge being opposite to the actuator in each instance, is supported at a dead stop.
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