CIRCUIT SUBSTRATE AND METHOD FOR MAKING THE SAME
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United States of America Patent
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Issued Date -
May 14, 2015
app pub date -
Nov 13, 2013
filing date -
Nov 13, 2013
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Abstract
A circuit substrate includes: a substrate; an insulating coating layered structure formed on the substrate, having top and bottom surfaces, and formed with a patterned recess that is indented inwardly from the top surface, that is disposed above the bottom surface, and that is defined by a recess-defining wall, the recess-defining wall having a bottom wall portion and a surrounding wall portion that extends upwardly from a periphery of the bottom wall portion; and a patterned metallic layered structure including an electroless plating metal layer formed on the bottom wall portion of the recess-defining wall.
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