ETCHING FLUID AND PRODUCTION METHOD FOR SILICON-BASED SUBSTRATE USING SAME

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United States of America Patent

APP PUB NO 20150125985A1
SERIAL NO

14400106

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Abstract

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It is the object of the present invention to provide an alkali etching solution for solar cell manufacturing, which is capable of forming uniformly a fine hubbly structure throughout a whole wafer on the surface of a wafer having a silicon as a main component, and still more is applicable to various wafers; and a method for manufacturing a silicon-based substrate for solar cell manufacturing, using the etching solution. The present invention relates to the alkali etching solution for solar cell manufacturing, comprising (A) a mono- or disulfonic acid or a salt thereof represented by the general formula [1], (B) an alkali compound, and (C) water; and a method for manufacturing a silicon-based substrate for solar cell manufacturing, characterized by etching a wafer having a silicon as a main component, using the etching solution, to form a hubbly structure at the surface of the wafer:

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Patent Owner(s)

Patent OwnerAddress
WAKO PURE CHEMICAL INDUSTRIES LTD1-2 DOSHOMACHI 3-CHOME CHUO-KU OSAKA-SHI OSAKA 540-8605

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kakizawa, Masahiko Kawagoe-shi, JP 20 497
Kawara, Shinshi Kawagoe-shi, JP 1 0
Ohuchi, Naoko Kawagoe-shi, JP 1 0
Tsurumoto, Hiroyuki Kawagoe-shi, JP 4 8
Watanabe, Terumi Kawagoe-shi, JP 3 11

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