Sealant Resin Composition, Laminated Film, And Packaging Bag

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United States of America Patent

APP PUB NO 20150125098A1
SERIAL NO

14361936

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Abstract

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A resin composition for a sealant which has heat-sealing properties and non-absorbing properties to an inorganic component contained in the content, a laminated film, and a packaging bag, and a resin composition for a sealant including a cycloolefin polymer and a cycloolefin copolymer, wherein the resin composition includes 10 to 95% by weight of the cycloolefin polymer and 5 to 90% by weight of the cycloolefin copolymer.

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Patent Owner(s)

Patent OwnerAddress
FUJIMORI KOGYO CO LTD1-1-1 KOISHIKAWA BUNKYO-KU TOKYO 1120002 ?1120002

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inada, Masakazu Kagoshima-shi, JP 5 22
Kashima, Kousuke Yokosuka-shi, JP 6 12
Okamoto, Hajime Yokohama-shi, JP 27 192
Yoshida, Mihoko Chiba-shi, JP 4 14

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