LEAD FRAME PACKAGE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
May 7, 2015
app pub date -
Apr 9, 2014
filing date -
Nov 1, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present disclosure relates to a package structure of a lead frame. The package includes a die, a dielectric layer, at least one conducting pillar, at least one lead frame and at least one solder ball. The dielectric layer is disposed on a surface of the die. The at least one conducting pillar penetrates through the dielectric layer and is disposed on the surface. The at least one lead frame is disposed on the dielectric layer and is spaced from the at least one conducting pillar with a gap. The solder ball fills the gap and electrically connects the at least one conducting pillar and the at least one lead frame.
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