FLIP CHIP LIGHT-EMITTING DIODE PACKAGE STRUCTURE
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United States of America Patent
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Issued Date -
May 7, 2015
app pub date -
Nov 6, 2013
filing date -
Nov 6, 2013
priority date (Note) -
Abandoned
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Abstract
A flip chip light-emitting diode (LED) package structure includes a circuit board, an electrical conducting layer and a plurality of flip chip light-emitting elements. The circuit board includes a bearing surface. The electrical conducting layer is formed on the bearing surface, and includes a plurality of electrical connection regions independent of each other. Each flip chip light-emitting element includes a p-type electrode and an n-type electrode. The p-type electrodes and the n-type electrodes of the flip chip light-emitting elements are electrically connected to the electrical connection regions, so that the flip chip light-emitting elements are electrically connected in series to form a package structure. During packaging of the flip chip light-emitting elements, the structure formed by the serial connection forms a circuit that can withstand a high voltage, and further reduce the current.
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