Solder piece, chip solder and method of fabricating solder piece
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United States of America Patent
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May 3, 2016
Issued Date -
N/A
app pub date -
Jan 15, 2015
filing date -
Sep 30, 2011
priority date (Note) -
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Abstract
A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is a vacuum pickup surface. Each vacuum pickup surface is a sheared surface and extends along a longitudinal direction of the rectangular parallelepiped solder piece. The solder piece may be located in an open cavity in a supply tape with one of only the four vacuum pickup surfaces exposed to be available for vacuum pickup.
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