SUBSTRATE PROCESSING APPARATUS
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United States of America Patent
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Issued Date -
May 7, 2015
app pub date -
Oct 22, 2014
filing date -
Nov 5, 2013
priority date (Note) -
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Abstract
Damage to a substrate in a substrate processing apparatus is effectively suppressed. The substrate processing apparatus includes a polishing unit polishing a substrate, a cleaning unit cleaning and drying the substrate polished by the polishing unit, and a conveying unit conveying the substrate in the polishing unit and the cleaning unit. The substrate processing apparatus further includes a measuring section 5A measuring a standby time of each substrate for which the substrate stands by in each of the polishing unit, the cleaning unit and the conveying unit, and a determining section 5B comparing the standby time measured by the measuring section 5A and a set time set for each unit independently and determining that an error occurs if the standby time exceeds the set time.
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