Film-Like Thermosetting Silicone Sealing Material
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United States of America Patent
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Issued Date -
Apr 30, 2015
app pub date -
Apr 23, 2013
filing date -
May 1, 2012
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Abandoned
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Abstract
The present invention relates to a film-like thermosetting silicone sealing material for sealing a semiconductor element by means of compression molding, the sealing material having an initial torque value of less than 15 dN·m as measured by an MDR (Moving Die Rheometer) at a molding temperature of from room temperature to 200° C., to a method for producing an LED by means of compression molding using the same, and to an LED produced by this method. The sealing material has excellent moldability, causes no problems such as overflow from a die, and has no defects such as voids.
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